Aluminum heat sink
For cooling semiconductor devices and printed circuit boards! Various cooling methods are possible, including natural heat dissipation and forced cooling.
It has excellent heat dissipation, is lightweight, and can be made in various cross-sectional shapes. Natural convection, forced cooling, and a variety of cooling methods are possible. It can be used for cooling semiconductor devices and printed circuit boards. 【Features】 ■ Excellent heat dissipation, lightweight, and can be made in various cross-sectional shapes ■ Natural convection, forced cooling, and a variety of cooling methods are possible *For more details, please refer to the PDF document or feel free to contact us.
- Company:篠原電機
- Price:Other